Holography features includes:

Nondestructive Defect Review in 3D interconnects, thin films, devices, ceramics, MEMS, Optoelectronics etc..

• Possess nanometer-scale resolution
• Enable subsurface imaging w/o cross-sectioning
• Cracks identification due to stress migration as a result of electrical and thermal stressing

Nondestructive Inspection for Emerging Nanotechnology

• Enable imaging of electro-mechanical defects (e.g. nanotube contacts)
• Enable imaging of nanoscale integrity in molecular assemblies
• Subsurface defect review and imaging in ferroelectrics, nanoparticles, interfacial, micro cracks and bulk defects

Nondestructive Defect Review and Process Control in Conventional IC materials and structures

Projected Performance Gains

• Nanostructural Metrology
  -- Mechanical imaging of molecular interconnects: Comparative modulus resolution ~ < 0.5%
  -- Mechanical imaging of molecular interconnects: Absolute modulus resolution ~ < 5%
• In-Line 3D Nanomechanical Imaging
  -- nondestructive surface/ subsurface defect identification
  -- XY resolution: < 1nm
  -- Z resolution < 10 nm (defect size)